Zen 4
Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022.[3][4][5] It is the successor to Zen 3 and uses TSMC's N5 process for CCDs.[6] Zen 4 powers Ryzen 7000 mainstream desktop processors (codenamed "Raphael") and will be used in high-end mobile processors (codenamed "Dragon Range"), thin & light mobile processors (codenamed "Phoenix"), as well as Epyc 9004 server processors (codenamed "Genoa" and "Bergamo").
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General information | |
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Launched | September 27, 2022 |
Designed by | AMD |
Common manufacturer(s) | |
Cache | |
L1 cache | 64 KB (per core) |
L2 cache | 1 MB (per core) |
L3 cache |
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Architecture and classification | |
Technology node | TSMC N5 (CCDs) TSMC N6 (I/O die)[1] |
Instruction set | AMD64 (x86_64) |
Physical specifications | |
Cores |
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Socket(s) |
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Products, models, variants | |
Product code name(s) |
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Brand name(s) | |
History | |
Predecessor | Zen 3 |
Successor | Zen 5 |
Support status | |
Supported |
Features
Like its predecessor, Zen 4 in its Desktop Ryzen variants features one or two Core Complex Dies (CCDs) built on TSMC's 5 nm process and one I/O die built on 6 nm.[7][8] Previously, the I/O die on Zen 3 was built on GlobalFoundries' 14 nm process for Epyc and 12 nm process for Ryzen. Zen 4's I/O die includes integrated RDNA 2 graphics for the first time on any Zen architecture. Zen 4 marks the first utilization of the 5 nm process for x86-based desktop processors.
On desktop and server platforms, Zen 4 supports only DDR5 memory, with support for DDR4 dropped. Additionally, Zen 4 supports new AMD EXPO SPD profiles for more comprehensive memory tuning and overclocking by the RAM manufacturers. Unlike Intel XMP, AMD EXPO is marketed as an open, license and royalty-free standard for describing memory kit parameters, such as operating frequency, timings and voltages. It allows to encode a wider set of timings to achieve better performance and compatibility. However, XMP memory profiles are still supported.[9] EXPO can also support Intel processors.[10]
All Ryzen desktop processors feature 28 (24 + 4) PCIe 5.0 lanes. This means that a discrete GPU can be connected by 16 PCIe lanes or two GPUs by 8 PCIe lanes each. Additionally, there are now 2 x 4 lane PCIe interfaces, most often used for M.2 storage devices. Whether the lanes connecting the GPUs in the mechanical x16 slots are executed as PCIe 4.0 or PCIe 5.0 can be configured by the mainboard manufacturers. Finally, 4 PCIe 5.0 lanes are reserved for connecting the south bridge chip or chipset.
Zen 4 is the first AMD microarchitecture to support AVX-512 instruction set extension. Most 512-bit vector instructions are split in two and executed by the 256-bit SIMD execution units internally. The two halves execute in parallel on a pair of execution units and are still tracked as a single micro-OP (except for stores), which means the execution latency isn't doubled compared to 256-bit vector instructions. There are four 256-bit execution units, which gives a maximum throughput of two 512-bit vector instructions per clock cycle, e.g. one multiplication and one addition. The maximum number of instructions per clock cycle is doubled for vectors of 256 bits or less. Load and store units are also 256 bits each, retaining the throughput of up to two 256-bit loads or one store per cycle that was supported by Zen 3. This translates to up to one 512-bit load per cycle or one 512-bit store per two cycles.[9][11][12]
Other features and improvements, compared to Zen 3, include:[9][11]
- L1 Branch Target Buffer (BTB) size increased by 50%, to 1.5K entries. Each entry is now able to store up to two branch targets, provided that the first branch is a conditional branch and the second branch is located within the same aligned 64-byte cache line as the first one.
- L2 BTB increased to 7K entries.
- Improved direct and indirect branch predictors.
- OP cache size increased by 68%, to 6.75K OPs. The OP cache is now able to produce up to 9 macro-OPs per cycle (up from 6).
- Re-order buffer (ROB) is increased by 25%, to 320 instructions.
- Integer register file increased to 224 registers, FP/vector register file increased to 192 registers. FP/vector register file widened to 512 bits to support AVX-512. Added a new mask register file, capable of storing 68 mask registers.
- Load queue size increased by 22%, to 88 pending loads.
- L2 cache is doubled, from 512 KiB to 1 MiB per core, 8-way.
- Automatic IBRS, where indirect branch restricted speculation mode is automatically enabled and disabled when control enters and leaves Ring 0 (kernel mode). This reduces the cost of user/kernel mode transitions.
- ~13% IPC increase on average.
- Up to 5.7 GHz max core frequency.
- Memory speeds up to DDR5-5200 are officially supported.
- In Ryzen 7000 desktop processors, the integrated GPU contains two RDNA 2 Compute Units running at up to 2.2 GHz.
Products
Raphael
On August 29, 2022, AMD announced four Zen 4-based Ryzen 7000 series desktop processors. The four Ryzen 7000 processors that were launched on September 27, 2022 consist of one Ryzen 5, one Ryzen 7, and two Ryzen 9 CPUs and they feature between 6 and 16 cores.[13] Common features of Ryzen 7000 desktop CPUs:
- Socket: AM5.
- All the CPUs support DDR5-5200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated RDNA2 GPU with 2 CUs and base, boost clock speeds of 0.4 GHz, 2.2 GHz.
- Fabrication process: TSMC N5.
- The retail versions of R9 7900, R7 7700 CPUs come with a Wraith Prism cooler, and the R5 7600 comes with a Wraith Stealth cooler.
Branding and model | Cores (threads) |
Clock rate (GHz) | L3 cache per CCD |
TDP | Chiplets | Core config[lower-roman 1] |
Release date |
MSRP | ||
---|---|---|---|---|---|---|---|---|---|---|
Base | Boost | |||||||||
Ryzen 9 | 7950X3D | 16 (32) | 4.2 | 5.7 | 32+96 MB[lower-roman 2] | 120 W | 2 × CCD 1 × I/OD |
2 × 8 | Feb 28, 2023 | US $699 |
7950X | 4.5 | 32+32 MB | 170 W | Sep 27, 2022 | ||||||
7900X3D | 12 (24) | 4.4 | 5.6 | 32+96 MB[lower-roman 2] | 120 W | 2 × 6 | Feb 28, 2023 | US $599 | ||
7900X | 4.7 | 32+32 MB | 170 W | Sep 27, 2022 | US $549 | |||||
7900 | 3.7 | 5.4 | 65 W | Jan 10, 2023 | US $429[16] | |||||
Ryzen 7 | 7800X3D | 8 (16) | 4.2 | 5.0 | 96 MB | 120 W | 1 × CCD 1 × I/OD |
1 × 8 | Apr 6, 2023 | US $449 |
7700X | 4.5 | 5.4 | 32 MB | 105 W | Sep 27, 2022 | US $399 | ||||
7700 | 3.8 | 5.3 | 65 W | Jan 10, 2023 | US $329[16] | |||||
Ryzen 5 | 7600X | 6 (12) | 4.7 | 105 W | 1 × 6 | Sep 27, 2022 | US $299 | |||
7600 | 3.8 | 5.1 | 65 W | Jan 10, 2023 | US $229[16] |
Mobile
At CES 2023, AMD announced its Phoenix and Dragon Range series of mobile processors based on Zen 4. The Phoenix processors target the mainstream notebook segment, feature an AI accelerator branded as "Ryzen AI", similar to Apple's Neural Engine, and is of a monolithic chip design, while the Dragon Range processors target the high-end segment, providing core counts up to 16 cores and 32 threads, and is built on a multi-chip module design, utilizing an I/O die and up to two core complex dies (CCDs).[17][18][19]
Phoenix
Common features of Ryzen 7040 notebook APUs:
- Socket: FP7, FP7r2, FP8.
- All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 20 PCIe 4.0 lanes.
- Includes integrated RDNA3 GPU.
- Includes XDNA AI Engine (Ryzen AI).
- Fabrication process: TSMC 4 nm FinFET.
Branding and model | CPU | GPU | TDP | Release date | ||||||
---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock (GHz) | L3 cache (total) |
Core config[lower-alpha 1] |
Model | Clock (GHz) | |||||
Base | Boost | |||||||||
Ryzen 9 | 7940HS | 8 (16) | 4.0 | 5.2 | 16 MB | 1 × 8 | 780M 12 CU |
2.8 | 35–54 W | May 2023 [20] |
7940H[lower-alpha 2] | ||||||||||
Ryzen 7 | 7840HS | 3.8 | 5.1 | 2.7 | ||||||
7840H[lower-alpha 2] | ||||||||||
7840U | 3.3 | 15–30 W | ||||||||
Ryzen 5 | 7640HS | 6 (12) | 4.3 | 5.0 | 1 × 6 | 760M 8 CU |
2.6 | 35–54 W | ||
7640H[lower-alpha 2] | ||||||||||
7640U | 3.5 | 4.9 | 15–30 W | |||||||
7540U | 3.2 | 740M 4 CU |
2.5 | |||||||
Ryzen 3 | 7440U | 4 (8) | 3.0 | 4.7 | 8 MB | 1 × 4 |
Dragon Range
Common features of Ryzen 7045 notebook APUs:
- Socket: FL1.
- All the CPUs support DDR5-5200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 28 PCIe 5.0 lanes.
- Includes integrated RDNA2 GPU on the I/O die.
- Fabrication process: TSMC 5 nm FinFET (6 nm FinFET for the I/O and graphics die).
Branding and model | CPU | GPU | TDP | Release date | ||||||
---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock (GHz) | L3 cache (total) |
Core config[lower-alpha 1] |
Model | Clock (GHz)[lower-roman 1] | |||||
Base | Boost | |||||||||
Ryzen 9 | 7945HX | 16 (32) | 2.5 | 5.4 | 64 MB | 2 × 8 | 610M 2 CU |
0.4 2.2 |
55–75 W | Feb 2023 [21] |
7845HX | 12 (24) | 3.0 | 5.2 | 2 × 6 | 45–75 W | |||||
Ryzen 7 | 7745HX | 8 (16) | 3.6 | 5.1 | 32 MB | 1 × 8 | ||||
Ryzen 5 | 7645HX | 6 (12) | 4.0 | 5.0 | 1 × 6 |
- Core Complexes (CCX) × cores per CCX
- Italic values indicate boost clock speeds
Genoa
On November 10, 2022, AMD launched the fourth generation (also known as the 9004 series) of Epyc server and data center processors based on the Zen 4 microarchitecture, codenamed Genoa.[22] Genoa features between 16 and 96 Zen 4 cores, alongside PCIe 5.0 and DDR5, designed for enterprise and cloud data center clients.
Model | Release date | Price (USD) |
Fab | Chiplets | Cores (Threads) |
Core config[lower-roman 1] |
Clock rate (GHz) |
Cache | Socket | Socket Count |
PCIe lanes |
Memory support |
TDP | ||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Base | Boost | L1 | L2 | L3 | DDR5 | ECC | |||||||||||
Mainstream Enterprise | |||||||||||||||||
9124 | November 10, 2022 | $1,083 | TSMC N5 |
2 × CCD 1 × I/OD |
16 (32) | 2 × 8 | 3.0 | 3.7 | 1 MB | 16 MB | 64 MB | SP5 | 1P/2P | 128 PCIe 5.0 |
DDR5-4800 twelve-channel |
Yes | 200 W |
9224 | $1,825 | 3 × CCD 1 × I/OD |
24 (48) | 3 × 8 | 2.5 | 3.7 | 1.5 MB | 24 MB | 96 MB | 200 W | |||||||
9254 | $2,299 | 4 × CCD 1 × I/OD |
4 × 6 | 2.9 | 4.15 | 128 MB | 220 W | ||||||||||
9334 | $2,990 | 32 (64) | 4 × 8 | 2.7 | 3.9 | 2 MB | 32 MB | 210 W | |||||||||
9354 | $3,420 | 8 × CCD 1 × I/OD |
8 × 4 | 3.25 | 3.75 | 256 MB | 280 W | ||||||||||
9354P | $2,730 | 1P | |||||||||||||||
Performance Enterprise | |||||||||||||||||
9174F | November 10, 2022 | $3,850 | TSMC N5 |
8 × CCD 1 × I/OD |
16 (32) | 8 × 2 | 4.1 | 4.4 | 1 MB | 16 MB | 256 MB | SP5 | 1P/2P | 128 PCIe 5.0 |
DDR5-4800 twelve-channel |
Yes | 320 W |
9274F | $3,060 | 24 (48) | 8 × 3 | 4.05 | 4.3 | 1.5 MB | 24 MB | ||||||||||
9374F | $4,860 | 32 (64) | 8 × 4 | 3.85 | 4.3 | 2 MB | 32 MB | ||||||||||
9474F | $6,780 | 48 (96) | 8 × 6 | 3.6 | 4.1 | 3 MB | 48 MB | 360 W | |||||||||
Cloud & HPC | |||||||||||||||||
9454 | November 10, 2022 | $5,225 | TSMC N5 |
6 × CCD 1 × I/OD |
48 (96) | 6 × 8 | 2.75 | 3.8 | 3 MB | 48 MB | 192 MB | SP5 | 1P/2P | 128 PCIe 5.0 |
DDR5-4800 twelve-channel |
Yes | 290 W |
9454P | $4,598 | 1P | |||||||||||||||
9534 | $8,803 | 8 × CCD 1 × I/OD |
64 (128) | 8 × 8 | 2.45 | 3.7 | 4 MB | 64 MB | 256 MB | 1P/2P | 280 W | ||||||
9554 | $9,087 | 3.1 | 3.75 | 360 W | |||||||||||||
9554P | $7,104 | 1P | |||||||||||||||
9634 | $10,304 | 12 × CCD 1 × I/OD |
84 (168) | 12 × 7 | 2.25 | 3.7 | 5.25 MB | 84 MB | 384 MB | 1P/2P | 290 W | ||||||
9654 | $11,805 | 96 (192) | 12 × 8 | 2.4 | 3.7 | 6 MB | 96 MB | 360 W | |||||||||
9654P | $10,625 | 1P |
- Core Complexes (CCX) × cores per CCX
Zen 4c
Zen 4c is a variant of Zen 4 featuring smaller Zen 4 cores with lower clock frequencies, power usage, reduced L3 cache, and is intended to fit a greater number of cores in a given space. Zen 4c cores will feature in AMD's Epyc server processors codenamed Bergamo coming in 2023.[23] Bergamo will feature up to 128 cores and 256 threads.[24] Zen 4c's smaller cores and higher core counts are designed for heavily multi-threaded workloads such as cloud computing.[25][26]
References
- Leather, Antony (May 23, 2022). "AMD Just Revealed Exciting Ryzen 7000 Details: 15% Faster, 5.5GHz, More Cache And Onboard Graphics". Forbes. Retrieved August 16, 2022.
- Shilov, Anton (September 28, 2022). "Ryzen Threadripper 7000 Storm Peak CPU Surfaces With 64 Zen 4 Cores". Tom's Hardware. Retrieved October 2, 2022.
- "AMD confirms Zen4 & Ryzen 7000 series lineup: Raphael in 2022, Dragon Range and Phoenix in 2023". VideoCardz. May 3, 2022. Retrieved August 16, 2022.
- Liu, Zhiye (May 3, 2022). "AMD Confirms Zen 4 Dragon Range, Phoenix APUs for 2023". Tom's Hardware. Retrieved August 16, 2022.
- Garreffa, Anthony (May 3, 2022). "AMD confirms Ryzen 7000 series CPUs this year: Zen 4 + DDR5 + PCIe 5.0". TweakTown. Retrieved August 16, 2022.
- Bonshor, Gavin (June 9, 2022). "AMD's Desktop CPU Roadmap: 2024 Brings Zen 5-based "Granite Ridge"". AnandTech. Retrieved June 11, 2022.
- Alcorn, Paul (May 23, 2022). "AMD Intros Zen 4 Ryzen 7000 CPUs and Motherboards: Up to 5.5 GHz, 15%+ Performance, RDNA 2 Graphics". Tom's Hardware. Retrieved August 16, 2022.
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- Roach, Jacob (September 6, 2022). "What is AMD EXPO and should my DDR5 have it?". Digital Trends. Retrieved October 2, 2022.
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- Fog, Agner. "The microarchitecture of Intel, AMD and VIA CPUs" (PDF). Agner Fog. Technical University of Denmark. Retrieved November 10, 2022.
- "AMD Ryzen 7000 "Zen4" desktop series launch September 27th, Ryzen 9 7950X for 699 USD". VideoCardz. August 29, 2022. Retrieved August 30, 2022.
- "AMD Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets". TechPowerUp. Retrieved January 5, 2023.
- https://www.youtube.com/watch?v=ZdO-5F86_xo&t=360s
- "AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop". AMD. Retrieved January 5, 2023.
- Alcorn, Paul (January 5, 2023). "AMD Brings Chiplets, Zen 4, RDNA 3 and XDNA AI to Laptops: 5nm Dragon Range and 4nm Phoenix Arrive". Tom's Hardware. Retrieved February 3, 2023.
- Burek, John (January 5, 2023). "'Phoenix' and 'Dragon Range' Arrive! AMD Outlines Ryzen 7000 Mobile CPUs, Some With Onboard 'Ryzen AI'". PCMag Australia. Retrieved February 13, 2023.
- Norem, Josh (February 6, 2023). "AMD's 'Dragon Range' 12-Core Mobile CPU Is 90% Faster Than 6900HX in PassMark". ExtremeTech. Retrieved February 13, 2023.
- "AMD Misses Ryzen 7040 Phoenix APU Launch Deadline, First Laptops Now Arriving In May". wccftech.com. Retrieved May 1, 2023.
- "AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop". AMD.
- Mujtaba, Hassan (November 10, 2022). "AMD 4th Gen EPYC 9004 "Genoa Zen 4" CPUs Launched: Up To 96 Cores, 192 Threads, 384 MB L3 Cache & Crushing All Other Server Chips". Wccftech. Retrieved November 13, 2022.
- Szewczyk, Chris (June 10, 2022). "AMD provides new Zen 4 details and touts a greater than 25% performance-per-watt gain". PC Gamer. Retrieved November 8, 2022.
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- Klotz, Aaron (September 1, 2022). "Zen 4 EPYC's New Naming Scheme Leaked". Tom's Hardware. Retrieved November 8, 2022.
- "AMD Unveils Workload-Tailored Innovations and Products at The Accelerated Data Center Premiere". AMD (Press release). Santa Clara, CA. November 8, 2021. Retrieved November 8, 2022.